Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices

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This is a Experimental Study study.

Rui Liu; Esteban Pedrueza‐Villalmanzo; Aldo Jesorka

doi:10.1038/s41598-025-19744-7

September 25, 2025Scientific ReportsOpen Access

Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices

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Key Points

The process enables the creation of free-standing microfluidic devices at a wafer scale, enhancing production efficiency.
Channel widths of approximately 30 µm were achieved using a combination of photolithography and lamination technology.
Fabrication was conducted in a cleanroom environment, emphasizing cleanliness and precision in device manufacturing.
This method may contribute significantly to advancements in microfluidic technology for various applications.

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Implication

Cleanroom fabrication process creates microfluidic devices with channel widths of ~30 µm, suggesting efficient manufacturing methods.

Abstract

We present a cleanroom fabrication process of free-standing open space microfluidic devices with channel widths of ~ 30 µm on the wafer scale by means of photolithography in combination with lamination technology.

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Cite This Study

Liu et al. (2025) studied this question.

synapsesocial.com/papers/68d7e84439bbb06045426cea https://doi.org/10.1038/s41598-025-19744-7

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Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices

Key Points

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Implication

Abstract

Discussion

Cite This Study

Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices

Key Points

Ask about this paper

Implication

Abstract

Discussion

Cite This Study

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