This study investigates thin structures by analyzing stress distribution in two different scenarios. In the first scenario, the absence of the E3 and d31 parameters is considered, while the second scenario examines their influence. The parameters vary according to a mixing rule based on thickness, with h1, h2, and h3 representing the distinct layers of the structure. The coordinate origin is positioned on the lower surface of the structure. The piezoelectric effect in semiconductor layers refers to the phenomenon where mechanical stress within the material generates an electric charge due to the inherent piezoelectric properties of the material. This effect significantly influences the stress distribution in semiconductor layers, altering their mechanical and electrical behavior. Understanding this impact is crucial for optimizing the design and performance of semiconductor devices, as it affects the material's ability to handle stress and distribute it evenly, thereby enhancing the reliability and efficiency of electronic components. This comparative analysis enhances the understanding of the piezoelectric effect on stress distribution in semiconductor layers. By comparing these two scenarios, significant differences in stress distribution are observed when piezoelectric effects are considered. Understanding how piezoelectric effects influence stress distribution aids engineers in designing better semiconductor layers, enhancing both performance and reliability. This research underscores the critical importance of considering piezoelectric effects in the design and analysis of thin structures. By incorporating these effects, engineers can develop semiconductor devices that are not only more efficient but also significantly more robust. The study's findings highlight the necessity of integrating piezoelectric considerations into engineering practices to optimize material properties and structural integrity, ultimately leading to advancements in semiconductor technology and contributing to the development of high-performance, reliable electronic devices.
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Abdallah et al. (2024) studied this question.
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