Numerical computation of capacitance matrices using conventional finite‐difference (FD) technique for arbitrarily shaped multi‐conductor problems which typically involve thin dielectric coating is challenging due to the fact that an extremely fine discretization of the computational domain is required to capture the nuances of the geometries involved, which, in turn, exacts a high computational resource cost—both in terms of memory and time. In this paper, we present a novel finite‐difference‐based technique which utilizes polynomial interpolation and extrapolation techniques in conjunction with the conventional finite‐difference technique to handle 2‐dimensional problems involving multiple conductors, typically with a thin dielectric coating. The proposed technique does not require fine discretization of the computational domain and provides accurate results in an efficient manner.
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Sharma et al. (2024) studied this question.
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