There has been a tremendous amount of research on two dimensional materials (2DMs) in recent years, suggesting their unique properties for optoelectronic devices. While a good momentum on implementing 2DMs for photodetection for visible and infrared (IR) photon detection exists, progress on demonstration of imaging systems based on these material have been slow. Most of reported studies have been based on single-pixel devices, which is unable to compete with the quantity and quality of information provided by massively parallelized mega-pixel imagers based on complementary metal-oxide semiconductor (CMOS) readout electronics. In this paper, we explore opportunities for achieving reliable and high-resolution FPA cameras using 2DMs. We will cover most relevant new materials in the field and cover photodetection methods. Our goal is to address the opportunities and challenges of using 2DMs for future imaging systems and their integration with CMOS electronics in a condensed form.
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Dehzangi et al. (2024) studied this question.
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