Stretchable Electronics A major challenge in stretchable electronics integration is the stress concentration that occurs at the interface of rigid chips and soft conductors. Article number 2313344 by Seung Hwan Ko and co-workers solves the issue by fabricating a gradient stiffness-programmed circuit board. Notably, the circuit board fully utilizes the spatially controlled phase-transition of supercooled hydrogel.
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Kim et al. (2024) studied this question.
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