May 28, 2024

Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-packaged Optics (CPO) in Hyperscale Data Center Networks

View Full Paper

Ask AI

Bookmark

Authors

APAparna PrasadCisco Systems (United States)CMCristiana Muzio PTPaul TonCisco Systems (United States)

Discussion

Member takes

Implication

Engineering demonstration shows a 3.2Tbs optical engine using 3D fanout packaging for switch networks, enabling compact low-parasitic co-packaged optics.

Key Points

A 3.2Tbs optical engine integrates on-chip mux-dmux with silicon photonics, achieving compact co-packaged optics for high-bandwidth switch systems.
Fabrication using advanced 3D packaging fanout technology connects photonic integrated circuits and electrical ICs through wafer scale redistribution layers.
A reworkable assembly method manages warpage across large organic substrates, which may enable scalable co-packaged optics in hyperscale data centers.

Cite This Study

Prasad et al. (2024) studied this question.

synapsesocial.com/papers/68e680f4b6db643587609d76 https://doi.org/10.1109/ectc51529.2024.00026

View Full Paper

Ask AI

Bookmark

Implication

Engineering demonstration shows a 3.2Tbs optical engine using 3D fanout packaging for switch networks, enabling compact low-parasitic co-packaged optics.

Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-packaged Optics (CPO) in Hyperscale Data Center Networks

Discussion

Member takes

Implication

Key Points

Cite This Study

Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-packaged Optics (CPO) in Hyperscale Data Center Networks

Discussion

Member takes

Implication

Key Points

Cite This Study

Also Consider

Also Consider