Results of a review of the cooling needs for high performance computing (HPC) processors using advanced packaging indicates benefits of implementing direct cooling through silicon microchannels. Progress in fabrication of silicon microchannels, both in microcooler/cold plate and in direct cooling of the die is assessed. Challenges in transferring silicon microchannels into HPC packaging are summarized, and steps towards commercialization are presented.
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Semenza et al. (2024) studied this question.
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