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May 28, 2024

Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers

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NKNahyeon KimHJHaksoon JungYLYongwoo Lee

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Kim et al. (2024) studied this question.

synapsesocial.com/papers/68e68365b6db64358760bd5ehttps://doi.org/10.1109/ectc51529.2024.00115
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