Development of robust and cost-effective electrical & optical interconnect solution for high performance silicon photonic applications

GF Fotonix, monolithic silicon platform has been developed by Globalfoundries on 300 mm high volume manufacturing environment. Both optical and electrical interconnects were enabled in the state-of-art design kit and can be realized in the same package form factor. Robust optical yield corridor IL feedback was performed with 6 months interval and no post-fab effect during electrical interconnect processing was observed. Stacked die level, point of concept (POC) modules were built and subject to various environmental conditions. 1t is worthwhile pointing out that this is the first industry demonstration of photonic integrated circuit (PIC) compatibility at 105 °C, at the package level.