Epoxy composites with excellent thermal properties are highly promising for thermal management applications in modern electronic devices. In this work, we report the enhancement of the thermal conductivity of two different nanocomposites, using epoxy resins LY564 (epoxy 1) and LY5052 (epoxy 2), by incorporating multiwalled boron nitride nanotubes (BNNT) and boron nitride nanosheets (BNNS) as fillers. The synergistic interaction between the 1D BNNT and 2D BNNS allows for improved thermal conductivity via several different mechanisms. The highest thermal conductivity was measured at a loading of 1/30 wt % of BNNT/BNNS, resulting in values of 2.6 and 3.4 Wm–1 K–1, respectively, for each epoxy matrix. This improvement is attributed to the formation of a three-dimensional heat flow path formed through intercalation of the nanotubes between the BNNS. The thermal conductivity of the epoxy 1 and 2 nanocomposites improved by 940 and 1500%, respectively, making them suitable as thermal interface materials in electronic applications requiring electrical resistivity.
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Mohanraman et al. (2024) studied this question.
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