This study reports a new mechanism of grain boundary (GB) sensitization without precipitation of Cr-rich phases at GBs in Cu-containing Ni-Cr-Fe alloys. Copper segregation at GBs during annealing can deplete the boundaries of Cr due to the repulsive interaction between Cr and Cu. The depletion of passivating Cr along GBs can cause intergranular corrosion susceptibility, as evidenced by electrochemical testing and post-mortem morphological characterization. The implications of this new sensitization mechanism on the localized corrosion resistance of Cu-containing commercial alloys are discussed.
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Hariharan et al. (2024) studied this question.
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