Analysis of Contamination Sources and Control Measures for Pre-cleaning of Power Semiconductor Metals

Metal deposition is a crucial step in the power semiconductor process, and the cleanliness of the wafer surface prior to metal deposition significantly impacts the quality of metal layer formation, as well as the parameters and appearance of both the wafer and final chip.Different types of contamination, such as organic matter, metals, and particles on the wafer surface, have distinct effects on both the metal layer and wafer.To address these various sources of contamination effectively, control measures are implemented across personnel, equipment, raw materials, regulations, and environment.Furthermore, targeted cleaning methods are developed based on specific types of primary contamination.