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We developed Co activation using reduction reaction and the bonding reliability when making thinner of the electroless Ni- P plating film was improved. Co activation was uniformly formed by reduction reaction, directly above the electroless Ni- P plating film also was uniformly deposited, and the plating film covering was improved. As a result, we considered that superior solder wettability and solder joint strength were obtained even with electroless Ni- P plating film thickness of 0.5μm and that Cu diffusion wasn't occurred in the solder when the solder was bonded.
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Kawasaki et al. (2024) studied this question.
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