During the reflow soldering, several phenomena occur such as wetting of the substrate by the liquid solder, interfacial reaction at the solder/substrate interface and solidification of unreacted solder. Each of these processes can play a crucial role on the subsequent evolution of the joint, and their control becomes more and more complex with the continuing trend towards the miniaturization. The aim of this work is to study the wetting and spreading of liquid In on a Au substrate as well the growth kinetics of intermetallic compound layers in Au/liquid In system at temperature range close to the reflow temperature in the context of interconnections development for soldering assembly of photonic components.
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Belhaddad et al. (2024) studied this question.
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