Solid-State Bonding with SAC305 Sheets for Direct Cooling

In this study, it was implemented SAC305 sheet bonding at 210 °C, which is lower than the melting temperature of SAC305 (218 °C), and by uniformly pressing with 5 MPa for 10 min at 210 °C and 220 °C, respectively. As a result, we achieved bonding strengths of approximately 12 MPa with a bonding time of only 10 min at 210 °C. In particular, it is interesting to note that it was solid-state bonded in the solder bonding process at 210 °C. The bonding strength originated from the diffusion of atoms with bond temperature. As the bonding temperature increased from 210 °C to 220 °C, the shear strength increased by 49.49 º/ <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">º</inf> . This study systematically investigated the mechanism of bonding strength in solid-state bonding of SAC305 sheets below their melting temperature, considering the relationship between microstructures and mechanical behaviors.