Development of Laminate Materials with Low Df using Novel Functionalized PPE

Novel network polymer with low <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> and high <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Tg</tex> derived from functionalized Polyphenylene ether (PPE) were developed. Vinylsilane functional group induced PPE (VS-970) on molecular ends were synthesized, and then evaluated as composition with SEBS (styrene butadiene block copolymer). Feature of VS-970 is excellent compatibility with SEBSs which have extremely low <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> (0.0005 @10GHz) before the curing reaction initiates. The homogeneous composition of VS-970/ SEBS make it possible to cure without compatibilizer such as triallyl isocyanurate (TAlC) with high <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> . As the results, cured VS-970/SEBS developed Iow <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> (0.0029@10GHz) which is 54% of cured methacrylate modified PPE (MA-PPE)/TAIC/SEBS. Cured VS-970 and its composition showed less frequency dependence of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> value compared with cured conventional system. PWB was developed using low-dielectric-property glass cloth (NE glass) without filler which decreases <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> value remarkably. Developed PWB performed <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Df</tex> 0.0029, which is 20% lower than PWB <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">(Df</tex> 0.0037) presently in practical use for <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5G</tex> application. Furthermore, the obtained PWB passed solder heat test without drawback of Cu peel strength.