The present research aims to achieve a shape-stable, and leakage-proof material for thermal energy storage (TES). The leakage analysis of 20 wt.% SiO2@Cu PCM shows 0.05%, as a result, more testing is conducted to assess its morphology, structure, and thermal properties. TGA and DSC studies demonstrated that the latent heat and thermal degradation rate (TDR) has been delayed, with a significant decrease in latent heat of roughly 8.7% compared to pure paraffin. Laser Flash Method (LFA) results revealed that the thermal conductivity (TC) of the PCM composite significantly increased 4.84 times than the paraffin.
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Bora et al. (2024) studied this question.
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