Exploring trade-offs in multi-site wafer testing

Wafer testing is a crucial process used to test the die before packaging. The process has undergone significant changes in the past year to reduce costs and ensure enough test coverage while preserving machinery and die integrity. The process is associated with significant costs and consumes considerable time.In this paper, we aim to provide an overview of the current state of wafer testing and highlight the most critical aspects of this type of testing. We will discuss the direction of the industry in this sector by highlighting the potential critical issues introduced by the current technological limit when implementing future technologies like denser pad disposition and multi-site testing.