Understanding the stability of advanced inorganic-organic hybrid thin films for advanced resist applications

In this study, we focus on examining the stability of Al-based inorganic-organic hybrid thin films deposited through the molecular atomic layer deposition (MALD) process in ambient environment. Our observations reveal an initial reduction in material thickness within the first 3 days, followed by a period of stability. XPS analysis is employed to further investigate the chemical alternations in the aged Al-based hybrid thin films, revealing an increase in C=O species as well as overall oxygen content in the material. We also evaluate the effects of atmospheric exposure on the sensitivity of the Al-based hybrid thin films using electron flood exposure. This study aims to enhance the understanding of the stability of a vapor-phase synthesized hybrid thin film system for advanced resist applications.