Design and Simulation of a High Cycle Fatigue Vibration Tester for Accelerated Stress Testing of Thin Films and Bimaterial interfaces

We introduce a high cycle fatigue test (HCF), which can be used for the accelerated stress testing of metallization layers and bi-material interfaces from microelectronic packages under controlled periodic displacement amplitudes and isothermal conditions. The main focus is the delamination of bi-material interfaces. For the test, samples are fabricated on a magnetic steel substrate using the same processes that are used to manufacture the microelectronic packages under consideration. Various schemes were developed for setting up the samples. To excite the sample, we use magnetic actuation. The sample is subjected to a cyclic strain by the oscillation and several million oscillation cycles can be carried out in a short time. The crack length is determined by a stiffness method recorded changes in the vibration spectrum of the beam. This stress method makes it possible to test the integrity of microelectronic components very fast under harsh conditions.