Low stress packaging of the small three-axis gyro

Abstract High-precision combined three-axis MEMS gyroscope is popular because of its high integration and miniaturization, but it also puts forward higher requirements for packaging. In this paper, the designed stress isolation structure is bonded between the MEMS chip and the package substrate according to the low stress method, which said the external stress is blocked and offset by the reverse stress generated by the elastic beam in the stress isolation structure, so as to ensure that the MEMS chip is kept in a low stress state. Simulation results show that the stress isolation structure can block 93.3% of the stress transmitted by the outside world. In the actual test, the stress isolation structure can also ensure that the output of the single-axis module of the three-axis gyro is stable and reliable, so as to improve the survival rate of the product.