We present our progress on developing an innovative compact thulium-based fiber CPA emitting at 2 µm central wavelength. The laser parameters comprise >100 µJ pulse energy at an average power of >30W. The system comes in an industrial-grade platform optimized for long-term operation and its optimized packaging is well suited for the integration in laser machines for materials processing. The laser parameters are ideally suited for processing semiconductors, e.g. silicon by microwelding or cutting of filaments.
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Gaida et al. (2024) studied this question.
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