We report high temperature mechanical properties of nanotwinned (NT) Cu, a key material for interconnects in advanced packaging. Our results showed softening of NT-Cu from 25∘ C to 220∘ C. Tensile strength and modulus decreased by ~ 90 % and ~ 80 % respectively, while the ductility increased by more than 3X. The results are critical in the process development for direct Cu-Cu bonding as well as modeling of the thermomechanical behavior of interconnect joints.
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Parween et al. (2024) studied this question.
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