The influence of surface roughness on heat transfer characteristics in micro channel heat sinks for electronic cooling application

Microchannel heat sinks are pivotal components in electronic cooling systems, efficientlydissipating heat generated by electronic devices. The optimization of heat transfer within theseheat sinks is paramount for enhancing thermal management in various applications. Among thecritical factors influencing heat transfer characteristics, surface roughness of microchannel wallshas garnered significant attention due to its profound impact on convective heat transfer andfluid flow behavior. This study aims to comprehensively investigate the influence of surfaceroughness on heat transfer performance in microchannel heat sinks, particularly focusing onelectronic cooling applications. The research employs a combination of numerical simulations and experimental analyses toexplore the intricate interplay between surface roughness, heat transfer, and fluid dynamics withinmicrochannels. Computational fluid dynamics (CFD) simulations are conducted to model the heattransfer phenomena and fluid flow behavior in microchannel heat sinks with varying degrees ofsurface roughness. Additionally, experimental studies are conducted to validate the simulationresults and provide empirical insights into the heat transfer characteristics under different surfaceroughness conditions. The outcomes of this research elucidate the complex relationship between surface roughness andheat transfer performance in microchannel heat sinks. Through systematic analyses of thermalresistance, pressure drop, and heat transfer coefficients, the study identifies optimal surfaceroughness parameters for maximizing heat dissipation efficiency while minimizing pressure droppenalties. Furthermore, the insights gained from this investigation facilitate the design andoptimization of microchannel heat sinks tailored to specific electronic cooling requirements. Overall, the findings from this study contribute to the advancement of thermal managementtechniques for electronic devices, offering valuable insights into the design and optimization ofmicrochannel heat sinks for enhanced heat dissipation capabilities in electronic coolingapplications.