Flip-Chip Low inductive and EMC optimized PCB Power Module

This paper presents an original power module based on printed circuit board technology. Two designs are compared, one based on flip-chip technology and the other based on conventional technology. The advantages of the flip-chip design are in term of stray inductances (sub nanohenry) and in term of EMC behavior are detailed. This kind of design is particularly adapted for GaN or SiC devices and their very high dv/dt and di/dt values during switching operation.