Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

With the continuous miniaturization of microelectronics, the need to effectively prevent thermal crosstalk between adjacent functional blocks is increasing. This study focuses on mitigating thermal crosstalk between high- and low-power components within the die-embedded glass interposer by incorporating a thermal isolation material─polyimide (PI) aerogels. Polyimide aerogels possess ultralow thermal conductivity of 0.029 W/(m K), low dielectric constant in the range of 1–3, and high-temperature stability up to 400 °C, which makes them an ideal candidate for a thermal isolation material. Given the complexity of the actual configurations, we leverage simulations to evaluate the isolation performance in this initial study. We first conducted infrared (IR) camera measurements on a simplified test setup to validate the thermal model. The results confirm the superior thermal isolation performance of PI aerogels, thereby demonstrating their potential as highly effective thermal isolation materials for microelectronic applications.