This study focuses on the enhanced passivation and gettering of boron‐doped p‐type solar grade silicon wafers by incorporating carrier‐selective and passivating tunnel oxide contact (TOPCon). A symmetrical stack of aluminum oxide (Al 2 O 3 )/p‐doped n‐type polysilicon (n‐poly‐Si)/ ultrathin silicon oxide (SiO x ) in conjunction with long cycles of forming gas annealing is used for enhancing the silicon wafer quality with a novel approach. Multilayer of n‐poly‐Si/SiO x on p‐type crystalline silicon wafer exhibits an implied open‐circuit voltage ( iV oc ) of 726 mV, effective carrier lifetime ( τ eff ) of 857 μs, and a low recombination current density ( J o ) of 1.9 fA cm −2 when subjected to a postdeposition annealing (PDA) of phosphorus‐doped hydrogenated amorphous silicon (n‐a‐Si:H) at 820 °C. To boost passivation and gettering quality, 10 nm‐thick Al 2 O 3 layers on both sides of n‐poly‐Si/SiO x samples are added. This leads to improved τ eff (962 μs), reduced J o (1.1 fA cm −2 ), and higher iV oc (728 mV). Herein, a thinner 50 nm n‐poly‐Si layer for improved properties is applied. The experiments show improved passivation and gettering. A Quokka‐3 simulation examines the potential of high‐efficiency p‐type TOPCon cells. A novel solar‐grade p‐type wafer quality enhancement approach is introduced, amalgamated with Quokka‐3 results, which could be a milestone in high‐efficiency p‐type TOPCon solar cell production.
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Khokhar et al. (2024) studied this question.
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