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October 11, 2025Journal of Electronic PackagingOpen Access

Current Advances and Outlook of Advanced Packaging

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Key Points

High bandwidth memory (HBM) is essential for AI-driven high-performance computing (HPC) products, showcasing significant advancements.
The study updates various IC integration types such as 2D and 3D, and highlights developments in packaging techniques like Cu-Cu hybrid bonding.
In-depth exploration of chiplet communication methods identifies key innovations in substrates and interposers for enhanced performance.
The integration of photonic and electronic interconnects emphasizes the push for higher data rates and AI compatibility in advanced packaging.

Implication

This analysis examines chiplet communication and high bandwidth memory in advanced packaging for AI-driven HPC.

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Cite This Study

John H. Lau (2025) studied this question.

synapsesocial.com/papers/68ecc715d1cc7436f7d18915 https://doi.org/10.1115/1.4070106

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Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

1Next Generation Heterogeneous 3D IC Chip Packaging2024
23.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators2024 · 34 citations
3Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, ReliabilityReview · 2026
4Recent Advances and Trends in Chiplet Design and Heterogeneous Integration PackagingOriginal Research · 2023 · 78 citations
5Solutions enabling advanced packaging and heterogeneous integration2024 · 2 citations

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