This research demonstrates how substrate miscut impacts the bandgap and crystallinity of hexagonal boron nitride films, indicating optimization strategies.
Boron nitride films are deposited on sapphire substrates with miscut angles (C-plane toward M-direction, 0.1°–4.0°) using radio frequency magnetron sputtering. The deposited films exhibit the characteristic hexagonal boron nitride (h-BN) phase with smooth, dense, and continuous surface morphology. Increasing the substrate miscut angle leads to a progressive deviation of the absorption edge and optical bandgap from those of ideal single-crystalline h-BN. Raman spectroscopy reveals a redshift and broadening of the E2g vibrational mode with increasing miscut, indicating reduced crystallinity and enhanced internal stress. The h-BN film grown on the substrate with a miscut angle of 0.1° shows the most desirable characteristics, including a bandgap of 5.59 eV, minimal residual stress, and the narrowest E2g peak. Metal–semiconductor–metal photodetectors fabricated from the optimized h-BN film demonstrates excellent performance, achieving a photo-to-dark ratio of 217 and a responsivity of 8240 μA/W at 20 V bias. These findings elucidate the influence of substrate miscut on the structural and functional properties of sputtered h-BN films, offering guidance for the controlled growth of high-performance BN-based optoelectronic devices.
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Tian et al. (2025) studied this question.
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