3D‐Optical Simulation of MicroOLEDs With Multiple Dipoles Based on Finite Element Method

Micro organic light‐emitting diodes (microOLEDs) are gaining attention for next‐generation augmented reality (AR) and virtual reality (VR) applications due to their compact form factors and high pixel density. However, traditional multilayer thin‐film simulations—based on the assumption of dipole emitters embedded in infinite planar layers—fail to capture the three‐dimensional optical effects of microOLEDs. This is primarily due to their micrometer‐scale pixel size, which becomes comparable to the vertical dimensions of the device, and the presence of a pixel define layer (PDL). To address these limitations, finite element methods (FEM) and finite‐difference time‐domain (FDTD) methods are commonly employed. However, these methods typically demand substantial computational resources, limiting their uses to the illustration of specific optical characteristics and trends rather than enabling a full quantitative analysis. This study introduces an optimized FEM‐based simulation method for micro‐scale OLEDs embedded with multiple dipole sources. By incorporating randomly distributed dipole sources with varied positions, orientations, and relative phases, the proposed approach enables accurate far‐field radiation pattern calculations while significantly reducing computational burden and simulation time, offering a promising pathway toward comprehensive optical analysis of microOLEDs and thus improving the understanding of light extraction and propagation at the micro‐pixel level.