Analysis reveals high predictive accuracy in thermal management for electronic devices using POD and RBF neural networks, suggesting improved real-time monitoring capabilities.
Efficient and accurate prediction of transient temperature fields is critical for thermal management of electronic devices with multiple heat sources. In this study, a reduced-order surrogate modeling approach is developed based on proper orthogonal decomposition (POD) and radial basis function (RBF) neural networks. The method maps time-conditioned modal coefficients in a parameter–time space, enabling robust temporal extrapolation beyond the training horizon. A multi-heat-source conduction model typical of electronic packages is used as the application scenario. Numerical experiments demonstrate that the proposed POD–RBF surrogate achieves high predictive accuracy (global MRE < 3%) with significantly reduced computational cost, offering strong potential for real-time thermal monitoring and management in electronic systems.
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Zhao et al. (2025) studied this question.
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