Circumferential Bulging Variation and Temperature Distribution of Profile-Tunable Roll for Freeform Optics in Roll-to-Plate (R2P) Hot-Embossing Process

The roll-to-plate (R2P) hot-embossing process is a newly developed molding technique for the high-throughput, high-efficiency fabrication of large-area microstructured optical elements. However, this technology is limited to flat surfaces, because the thickness of the freeform optical plate varies constantly due to its specific optical design, while the roll stays cylindrical during rolling. Therefore, we developed a new profile-tunable roll with several groups of semiconductor heater/coolers (SHCs) attached around the inside wall of the roll. These SHCs can achieve tunable roll profiles at desirable positions by regulating the current for the semiconductor and then the roll temperature, thereby producing optics with a selected freeform. In this paper, the circumferential bulging profiles and corresponding roll temperature fields were thoroughly investigated under various heater/cooler layouts and roll sizes. A circumferential finite element model of the profile-tunable roll was established using the finite element software MSC.MARC 2020 and then verified on the experimental platform. In addition, the fundamental relationship between the bulging values and temperature distributions of the roll and parameters, such as the outer diameter and inner diameter of the roll, the temperature of the semiconductor heater/cooler, and the single piece influence angle, was eventually established. This paper offers a unique fabrication method for high-volume optical freeform plates at extremely low cost and builds a foundation for further research on the axial deformation and temperature distribution of the developed roll for freeform optics and R2P hot-embossing experiments for freeform optical components.