Atom-precise copper nanoclusters (Cu NCs) with near-infrared (NIR) luminescence show promise in biomedical and optoelectronic applications, due to their cost-effectiveness, low toxicity, and tunable photophysics. However, their practical application is limited by extremely low NIR photoluminescence quantum yields (PLQYs) (15(TPP)6(PET)13]2+ (Cu15-TPP) and its diphosphine analogue Cu15(DPPB)3(PET)12H2+ (Cu15-DPPB), which exhibit drastically different NIR PLQYs. Single-crystal X-ray diffraction (SC-XRD) reveals that both NCs feature a comparable triple-helical Cu9 core but distinct surface ligand arrangements. In Cu15-DPPB, the diphosphine chelator DPPB adopts a cis-cis conformation to rigidify ligand shell. In contrast, the monodentate TPP ligand in Cu15-TPP leads to a less rigidified ligand shell. This structural disparity enables a 186-fold enhancement in NIR PLQY for Cu15-DPPB (37.2% in nondegassed solution and 46% in the solid state at RT) versus Cu15-TPP (0.2% in solution), with emission maxima at ∼750 nm. The 37.2% PLQY of Cu15-DPPB is the highest reported for solution-phase NIR-emitting Cu-thiolate NCs. Excited-state dynamics studies unveil that this surface rigidification accelerates intersystem crossing (ISC) to populate triplet-state with boosted radiative decay (∼157-fold higher), and suppresses the nonradiative decay (∼0.53-fold lower). These findings demonstrate that ligand conformational engineering offers a new strategy to overcome intrinsic limitations of Cu-based emitters (e.g., weak spin-orbit coupling and slow intersystem crossing), and develop high-performance solution-phase RT NIR luminescent Cu NCs.
Liu et al. (2026) studied this question.