The long-term interfacial reliability of Cu/Al brazed joints is critical for power equipment but is often compromised by severe intermetallic compound (IMC) degradation during thermal aging. This study investigates the evolution mechanism and mechanical stability of Cu/Al joints brazed with 0.5 wt.% Ga-modified Zn-15Al filler metal, aged at 200 °C for up to 1000 h. Microstructural evolution, diffusion kinetics, and mechanical properties were systematically characterized using SEM, EDS, nanoindentation, and shear testing. Results indicate that the unmodified control interface degrades via Zn-diffusion-driven “in situ Cu depletion” of the Cu9Al4 layer, leading to severe embrittlement. In contrast, the addition of Ga induces a “sacrificial reconstruction” mechanism, where the outer CuAl2 layer transforms into a dense lamellar ternary structure via cellular decomposition. This reconstructed layer acts as an effective diffusion barrier and “Zn sink,” trapping infiltrating atoms and preserving the structural integrity of the underlying Cu9Al4 phase. Consequently, the Ga-modified joints demonstrate superior shear strength retention and an optimized H/E ratio throughout the aging process, shifting the failure mode from brittle cleavage to a toughened lamellar peeling mechanism. This work elucidates how Ga-modulated phase reconstruction fundamentally enhances interfacial stability, offering a theoretical basis for high-reliability interconnects.
Chen et al. (2026) studied this question.