Theoretical screening of Co-and Mo-based binary alloys for interconnect metal

Seongwoo Kang; Shinyeong Park; Jiwon Chang

doi:10.1039/d5tc04036a

January 1, 2026Journal of Materials Chemistry COpen Access

Theoretical screening of Co-and Mo-based binary alloys for interconnect metal

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Key Points

This research aims to identify alternative alloy materials for interconnect applications to overcome the limitations of copper.
Conducted theoretical screening of Co- and Mo-based binary alloys.
Analyzed electron-phonon scattering effects in these alloys.
Compared performance metrics of selected alloys against traditional copper.
Identified specific Co- and Mo-based alloys with lower electron-phonon scattering rates.
Demonstrated potential for improved conductivity in certain alloy combinations.
Highlighted the performance benefits of these alloys over conventional copper.

Implication

Theoretical analysis identifies promising alloys for interconnect metals, indicating potential for improved performance.

Abstract

With continued device scaling, the use of copper (Cu) as an interconnect material has reached its limits for two main reasons.First, electron-phonon scattering, which dominates in the bulk form, becomes...

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Cite This Study

Kang et al. (2026) studied this question.

synapsesocial.com/papers/6980fe7cc1c9540dea8109ab https://doi.org/10.1039/d5tc04036a

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Theoretical screening of Co-and Mo-based binary alloys for interconnect metal

Key Points

Implication

Abstract

Discussion

Cite This Study

Theoretical screening of Co-and Mo-based binary alloys for interconnect metal

Key Points

Implication

Abstract

Discussion

Cite This Study

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