Surface Topography and Microstructure of Copper Plating Machined with Single-Crystal Diamond Tool

Key Points

• The aim is to understand the surface and microstructural characteristics of copper plating when machined with a single-crystal diamond tool.
• Evaluated surface topographies using white light interferometry (WLI) and atomic force microscopy (AFM).
• Conducted power spectral density (PSD) analysis to assess smoothness at various spatial frequencies.
• Performed microstructural analysis using electron backscatter diffraction (EBSD) and X-ray diffraction (XRD).
• Copper plating showed smoother surfaces than oxygen-free copper at frequencies below 2 × 10⁴ mm⁻¹.
• The PSD of copper plating was highest at frequencies above 2 × 10⁴ mm⁻¹ due to a sand-like texture.
• Microstructural analysis revealed that the surface consists of fine crystalline grains.

Abstract