This work demonstrates improved interfacial adhesion in copper-Ajinomoto films through ascorbic acid-assisted self-assembly of 4-aminothiophenol, suggesting benefits for advanced packaging.
High-speed data transmission requires the formation of fine and smooth Cu wiring, which inevitably causes a decline of interfacial bonding strength between Cu and the insulating dielectric layer. In this work, 4-aminothiophenol (4-ATP) is used as a bifunctional promoter for the interfacial adhesion between a Cu foil and a widely used Ajinomoto build-up film (ABF) without coarsening the Cu surface. It is found that the introduction of ascorbic acid (AA) accelerates the self-assembly process of 4-ATP on Cu surface, as monitored by in situ attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS) and examined by cyclic voltammetry (CV). Peel strength tests and morphology analyses reveal that the AA-assisted 4-ATP SAM significantly enhances the interfacial adhesion between Cu and ABF, which is of practical significance in advanced packaging.
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Xu et al. (2026) studied this question.
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