Hexagonal boron nitride (h-BN) is an ideal filler for enhancing the thermal conductivity of polymer matrix thermal interface material (TIM) due to its superior thermal conductivity and exceptional electrical insulation properties. The thermal conduction performance of TIM is largely determined by the filler orientation and interface interaction between polymer matrix and fillers. In this work, glycine-modified h-BN (Gly-BN) was synthesized through ball milling-assisted ultrasonic liquid-phase exfoliation to strengthen the interface interaction between the filler and polymer matrix, and then, Gly-BN-filled epoxy resin (EP) composites with directionally arranged fillers were prepared by tape casting for the first time. Under the mechanical force of the casting scraper, Gly-BN was aligned horizontally, thereby establishing highly efficient heat transfer path. Thermal conductivity is enhanced with increasing the filler content, reaching 5.025 W/(m·K) with 40 wt.% Gly-BN, which is 27 times that of EP. The composites exhibit excellent heat dissipation properties, demonstrating application potential as TIM for electronic devices.
Cui et al. (Fri,) studied this question.