Experimental analysis shows effective intermetallic compound formation during chip-level bonding, indicating reliable microelectronic coupling.
This study investigates intermetallic compound (IMC) formation during transient inductive chip-level bonding using SnCuSn foil for microelectronic packaging. It combines experimental work with finite element simulations in COMSOL Multiphysics to analyze localized electromagnetic heating and phase evolution. A copper coil enables selective heating at the bonding interface, leading to the formation of Cu₆Sn₅ and Cu₃Sn phases, verified through metallographic analysis. The results show strong agreement between simulations and experiments, demonstrating that inductive bonding provides fast, localized, and reliable joining while minimizing thermal stress on surrounding microelectronic components.
No takes yet. Share an insight, caveat, or question.
Panhale et al. (2026) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: