Dual-Circuit Regolith Thermal Management System for Extraterrestrial Computing Infrastructure

This technical disclosure describes a dual-circuit thermal management system for computing infrastructure deployed on the lunar surface or other airless extraterrestrial bodies. The system addresses the challenge of heat dissipation in vacuum environments where convective cooling is unavailable. The proposed approach applies established liquid cooling principles to a specific context not previously documented in the patent literature: lunar regolith saturated with a low-freezing-point dielectric fluid serves as a passive thermal buffer surrounding sealed subterranean radiator elements connected to a primary coolant circuit. Key characteristics: no moving parts in the secondary medium; thermal conductivity of the saturated regolith composite estimated at 0.08–0.12 W/(m·K) versus 0.005 W/(m·K) for dry regolith; scalable by excavated volume without additional hardware delivery from Earth; applicable to Moon, Mars, and other airless bodies. Document includes system architecture, method description, materials specification, thermal performance model, and 10 patent claims formatted for EPO submission. Published as a prior art disclosure to establish priority date.