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Synapse
February 28, 2026Electronics0 citationsOpen Access

Experimental Investigation of Heat Pipe-Assisted Cooling for Heat Creep Mitigation in FFF Extruders

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PSPaweł SzymańskiCPCharles Pelle

Key Points

  • This investigation aims to evaluate the effectiveness of heat pipe-assisted cooling in reducing heat creep during FFF processes.
  • Measured vertical air-temperature gradients above heated build plates in different printer architectures.
  • Quantified cold-end temperatures for standard extruder configurations under forced and natural convection while printing with PLA and ABS.
  • Tested a modified extruder design utilizing a heat pipe for improved thermal management under simulated fan failure conditions.
  • The modified design reduced cold-end temperatures by approximately 8% compared to the stock configuration.
  • Enhanced thermal stability was achieved during printing cycles without active cooling.
  • Elevated heat-rejection locations exhibited improved natural-convection heat transfer.

Abstract

Heat creep is a critical failure mechanism in fused filament fabrication (FFF) extrusion systems, arising from insufficient thermal isolation between the hot end and cold end. It causes premature polymer softening, extrusion instability, and nozzle clogging, especially when active cooling is reduced or lost. This study experimentally evaluates passive cooling strategies for mitigating heat creep in consumer-class printers by exploiting ambient thermal stratification within the build volume. Vertical air-temperature gradients above heated build plates were measured for enclosed, semi-enclosed, and open-frame architectures, revealing pronounced stratification. Cold-end temperatures were then quantified for a stock extruder under forced and natural convection while printing polylactic acid (PLA) and acrylonitrile butadiene styrene (ABS). Finally, a modified cold-end using a heat pipe to relocate heat rejection to an elevated heat sink was tested under identical conditions, assuming fan failure. Elevated heat-rejection locations experienced lower ambient temperatures and improved natural-convection heat transfer. Relative to the stock configuration, the augmented design reduced cold-end temperatures and improved thermal stability during representative printing cycles without continuous active cooling—the improvement percent is ~8%. The results demonstrate that coupling heat-pipe conduction with environmental thermal gradients can mitigate heat creep and improve extruder reliability with lower energy demand.

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Cite This Study

Szymański et al. (2026) studied this question.

synapsesocial.com/papers/69a288590a974eb0d3c0433bhttps://doi.org/10.3390/electronics15050976
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1A Review on Filament Materials for Fused Filament Fabrication2021 · 248 citations
  2. 2Measurement, characterisation and influence of the air temperature above the build plate in fused filament fabrication2021 · 10 citations
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  4. 4Parametric optimization of layer thickness, speed, and high acceleration on surface roughness, productivity, and quality of 3D printed PLA objects2025 · 3 citations
  5. 5Thermosyphons and Heat Pipes: Theory and Applications2020 · 75 citations