Numerical study optimizes blank shapes for heat sink substrates, suggesting improved performance and efficiency.
Key Points
The research aims to enhance the shaping and dimensional design of copper pin-type heat sink substrates to improve thermal dissipation and reduce forming loads.
Designed four blank shapes using finite-element simulation
Investigated effects of shape and placement orientation on forming quality
Conducted dimensional optimization for optimal configuration
Performed experiments to verify feasibility of the optimized design.
Stepped blank with front orientation exhibited the optimal forming performance
Achieved a forming load reduction to 15,000 kN, a 35.3% decrease
Substrate thickness and pin-fin height met design requirements (4.5 mm and 6.5 mm)
Higher and more uniform material flow velocity reported with front orientation.