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March 6, 2026Journal of Vacuum Science & Technology A Vacuum Surfaces and Films3 citations

Atomic layer deposition of zinc oxide films on lateral high-aspect-ratio test structures using diethylzinc and water as precursors

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EHEero HaimiAPAnish PhilipJVJorge Velasco

Key Points

  • This research aims to grow high-quality zinc oxide thin films using atomic layer deposition for various applications.
  • Utilized diethylzinc and water as precursors for film growth.
  • Employed atomic layer deposition on lateral high-aspect-ratio test structures.
  • Characterized films using energy-dispersive electron probe x-ray microanalysis and x-ray reflectometry.
  • Conducted diffusion-reaction simulations to analyze growth kinetics and film thickness.
  • Achieved film thickness profile that closely matches the ideal saturation profile at 200 °C growth temperature.
  • Demonstrated excellent film conformality on high-aspect-ratio structures.
  • Provided a strong reference case for optimizing the atomic layer deposition process.

Abstract

Zinc oxide is a wide bandgap semiconductor with a variety of applications as a thin film material. In this work, a set of zinc oxide thin films were grown on lateral high-aspect-ratio test structures using atomic layer deposition. Diethylzinc and water were used as precursors, and several processing conditions were examined. The grown films were characterized for conformality using energy-dispersive electron probe x-ray microanalysis supported by x-ray reflectometry studies of additional reference samples. To analyze growth kinetics and film thickness profiles, diffusion-reaction simulations were made. Most importantly, it was found that at the 200 °C growth temperature, the film thickness profile followed nearly perfectly the ideal saturation profile expected for self-terminating reactions. The obtained result, thus, establishes an excellent reference case for process optimization.

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Cite This Study

Haimi et al. (2026) studied this question.

synapsesocial.com/papers/69aa70f8531e4c4a9ff5b414https://doi.org/10.1116/6.0004982
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