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March 13, 2026National Science Open0 citationsOpen Access

Fibre Integrated Circuits Towards Intelligent Wearable Electronics

ZRZhihao RenXSXiaoyu ShiZWZhongshuai Wu

Key Points

  • To explore the limitations and future potentials of fibre integrated circuits for wearable technologies.
  • Review of current multifunctional fibre devices
  • Analysis of signal processing requirements
  • Evaluation of fabrication challenges for fibres
  • Existing fibre devices can perform functions like sensing and energy storage.
  • Current signal processing relies on rigid silicon chips, limiting flexibility.
  • A major challenge is the high-resolution fabrication due to the geometry of fibres.

Abstract

The advancement of wearable electronics is accelerating the evolution of devices toward multifunctionality and system-level integration 1.Current fibre devices already demonstrated multiple discrete functions, such as energy harvesting and storage, sensing, and display, thereby laying a foundation for future intelligent wearable platforms 2.Nevertheless, the essential signal processing components in such system still depend on externally connected rigid silicon-based chips.This limitation fundamentally contradicts the flexible and conformal nature of fibres and severely impedes the realization of truly integrated smart fibre systems 3,4.The critical bottleneck stems from the intrinsic curved geometry and limited surface area of fibres, which hinder the high-resolution fabrication of dense, multifunctional

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Cite This Study

Ren et al. (2026) studied this question.

synapsesocial.com/papers/69b3ab2902a1e69014ccbc31https://doi.org/10.1360/nso/20260023
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