Electrodeposition reveals the correlation between substrate morphology and copper film quality in high-carbon steel, suggesting optimization strategies.
Electrodeposition of copper on the surface of the high-carbon steel (HCS) cathode was carried out in situ during the electrolysis of an aqueous KOH solution with a copper anode. A mechanism was proposed for the transfer of the copper from the anode to the cathode, followed by the formation of a copper film on the HCS. The surface roughness of the substrate and the copper coating was studied using AFM and profilographic data. There is a discrepancy between the roughness values of the substrate and coating obtained using different techniques. The surface morphology of the substrate was found to affect the copper film quality. The roughness of the copper coating calculated using AFM data replicated the roughness of the substrate surface. It was found that, despite some difference in the roughness calculated by profilographic and AFM data, the overall roughness trend remains unchanged.
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Sidorova et al. (2026) studied this question.
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