Influence of Transfer Molding on the Reliability of DCM SiC Power Modules

Key Points

• This research aims to evaluate how transfer molding influences the reliability of DCM SiC power modules.
• Examined the transfer molding process
• Analyzed the durability of SiC power modules
• Conducted reliability testing under various conditions
• Measured dielectric and thermal properties
• Transfer molding improved reliability metrics by 25%
• Modules displayed enhanced thermal conductivity
• Reduction in failure rates under stress conditions observed