High Temperature Substrate from 3D Glass Solutions

Current high temperature substrate solutions provided by cofired ceramics are limited by factors including large line and space dimensions, a lack of integrated passive components, and incompatibility with vertically stacked heterogeneous integration methods. These limitations challenge the development of technologies for hypersonics, automotive electronics, geothermal downhole applications, and many others. In this talk, 3D Glass Solutions (3D Glass) presents design rules and data to support a photosensitive glass-ceramic (PSG) substrate which enables high routing density, integrated resistors, substrate cavities, and vertically stacked heterogeneous integration (3DHI) capabilities. We will articulate the advantages of using PSG ceramic as a substrate for high temperature electronics and share our work demonstrating this substrate in quasi-coax partial air transmission line. This work includes design rules for the substrate and electrical and thermal test data verifying functionality and reliability up to 500°C. The described work demonstrates a manufacturing platform for high temperature compatible advanced packaging technologies. In this presentation, we detail production and assembly factors that impact size, weight, and performance (SWAP) metrics for a variety of product definitions. We also discuss the reliability of simulation results vs. product test results to demonstrate a reliable design to product flow.