Solution and Vacuum‐Based Scalable Deposition Methods for Perovskite/Si Tandem Solar Cells

Perovskite/Si tandem solar cells (TSCs) have recently made rapid progress, with certified power conversion efficiencies (PCEs) reaching 34.85%, highlighting their strong potential to surpass the efficiency limits of conventional single‐junction Si devices. The realization of such highly efficient TSCs largely relies on solution, vacuum, and hybrid deposition methods. These technologies include spin‐coating, slot‐die coating, blade coating, spray‐coating, screen printing, inkjet printing, thermal evaporation, sputtering, and atomic layer deposition (ALD), along with approaches combining solution and vacuum techniques. This review paper summarizes the deposition methods used to fabricate perovskite films, carrier transport layers (CTLs), and electrodes for the top perovskite cell of perovskite/Si TSCs. Additionally, this review outlines deposition methods for interconnection layers (ICLs) between perovskite and Si sub‐cells, as well as the encapsulation required for the long‐term stability of TSCs. Furthermore, a cost comparison between solution‐processed and vacuum‐based methods is presented. Finally, the review discusses future directions and challenges of perovskite/Si TSCs.