Anisotropic Polyimide/MCMB/GO/ Polymer Composite Bifunctional Materials With High Through‐Plane Thermal Conductivity and EMI Shielding Effectiveness

With heat dissipation and electromagnetic interference (EMI) caused by the integration of electronic elements becoming more serious, developing thermal interface materials (TIMs) with higher thermal conductivity, and EMI shielding performance is urgent. An anisotropic polyimide/mesocarbon microbeads/graphene oxide/polymer composite bifunctional material (PDMS/PMGO) has been successfully prepared by the directional freezing method and multistep high‐temperature thermal annealing. PDMS/PMGO has high through‐plane thermal conductivity (7.191 W·m −1 ·K −1 ), excellent EMI shielding performance (high absorption loss of 68.66 dB and electromagnetic shielding efficiencies of 77.46 dB), good mechanical strength, thermal stability properties, and compressive strength. PDMS/PMGO has the potential to be used as a new generation of TIMs and electromagnetic shielding materials in high frequency electronic devices, aerospace and smart wearable devices.