This research aims to develop a low dielectric polyimide material through post-polymerization cross-linking techniques.
Preparation of a polyimide matrix containing fluorene groups.
Application of post-polymerization cross-linking techniques.
Characterization of dielectric performance and structural integrity.
Demonstrated low dielectric performance of the cross-linked polyimide.
Achieved enhanced structural integrity compared to non-cross-linked variants.
Abstract
Post-polymerization cross-linking to produce a free-volume developed aromatic polyimide matrix with advanced low dielectric performance and robust structural integrity.