Preparation and characterization of low dielectric cross-linked polyimide containing fluorene group via post-polymerization cross-linking

Key Points

• This research aims to develop a low dielectric polyimide material through post-polymerization cross-linking techniques.
• Preparation of a polyimide matrix containing fluorene groups.
• Application of post-polymerization cross-linking techniques.
• Characterization of dielectric performance and structural integrity.
• Demonstrated low dielectric performance of the cross-linked polyimide.
• Achieved enhanced structural integrity compared to non-cross-linked variants.